JIS Z 3198-3:2003
Test methods for lead-free solders -- Part 3: Methods for spread test

Standard No.

JIS Z 3198-3:2003

Release Date

2003

Published By

Japanese Industrial Standards Committee (JISC)

Status

Be replaced

Replace By

JIS Z 3198-3 ERRATUM 1:2003

Latest

JIS Z 3198-3 ERRATUM 1:2003

Scope

This standard specifies the spread test method for lead-free solder, which is mainly used for wiring connections and component connections in electrical equipment, electronic equipment, communication equipment, etc.

JIS Z 3198-3:2003 history

• 2003 JIS Z 3198-3 ERRATUM 1:2003 ERRATUM
• 2003 JIS Z 3198-3:2003 Test methods for lead-free solders -- Part 3: Methods for spread test