This Korean Industrial Standard specifies thin copper-clad laminates for multilayer printed circuits (hereafter referred to as "copper-clad laminates") used mainly for multilayer printed wiring boards. First of all, it is applicable for the one whose thickness of insulating board, which is plated by copper foil of 0.018mm, 0.035mm or 0.070mm on the one side or both sides of its laminated layer, is 0.1mm to 0.8mm excl. in thickness. However, It is not applicable for its part within 6mm from the edge of copper-clad laminated layer.
Remark The units and numerical values given in { } in this standard are based on the Internationa] System of Units (SI), and are appended for informative reference.
KS C 6461-1990 history
2002KS C 6461-2002 THIN COPPER-CLAD LAMINATES FOR MULTILAYER PRINTED CIRCUITS (GLASS FABRIC BASE, EPOXY RESIN)
0000 KS C 6461-1990(2000)
1990KS C 6461-1990 THIN COPPER-CLAD LAMINATES FOR MULTILAYER PRINTED CIRCUITS (GLASS FABRIC BASE, EPOXY RESIN)