This standard specifies methods for measuring the melting temperature range of lead-free solder, which is mainly used for wiring connections and component connections in electrical equipment, power supply equipment, communication equipment, etc.
JIS Z 3198-1:2003 history
2014JIS Z 3198-1:2014 Test methods for lead-free solders.Part 1: Methods for measuring of melting temperature ranges
2003JIS Z 3198-1:2003 Test methods for lead-free solders -- Part 1: Methods for measuring of melting temperature ranges