This Korean Industrial Standard specifies copper-clad laminates for printed wiring boards employing glass cloth surfaces, non woven glass core and epoxy resin as the materials (hereafter referred to as "copper-clad laminates") with basis on the specification of KS C 6480(General rules of copper-clod laminates for printed wiring boards). In addition, the test methods shall comply with KS C 6481 (Test methods of copper-clad laminates for printed wiring boands).
Remarks 1. The units and numerical values given in { } in this standard are based on the traditional units and are appended for Informative Reference. 2. As illustrated in Fig. , this copper-clad laminate is composed of such compound materials that the intermediate layer is non-woven glass core epoxy resin, glass fabric base epoxy resin layers are provided on front and rear surfaces of the above, and further copper foil is pasted on one side or both sides.
Copper foil
Glass fabric base, epoxy reain Non woven glass core, epoxy resin Glass fabric base, epoxy resin Copper foil
Fig. Structure of Copper-clad Laminate(both sided)
KS C 6474-1991 history
2002KS C 6474-2002 COPPER-CLAD LAMINATES FOR PRINTED WIRING BOARDS ( GLASS CLOTH SURFACES, NONWOVEN GLASS CORE, EPOXY RESIN )
0000 KS C 6474-1991(2001)
1991KS C 6474-1991 COPPER-CLAD LAMINATES FOR PRINTED WIRING BOARDS ( GLASS CLOTH SURFACES, NONWOVEN GLASS CORE, EPOXY RESIN )