DIN EN 60749-3:2003
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection (IEC 60749-3:2002); German version EN 60749-3:2002
- Standard No.
- DIN EN 60749-3:2003
- Release Date
- 2003
- Published By
- German Institute for Standardization
- Status
- Replace By
- DIN EN 60749-3:2018
- DIN EN 60749-3 E:2017
- Latest
- DIN EN 60749-3:2018
- DIN EN 60749-3:2018-01
- Replace
- DIN EN 60749:2002
- Scope
- The pupose of this part of DIN EN 60749 is to verify that the materials, design, construction, markings and wrokmanship of a semiconductor device are in accordance with applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process-monitor, or lot acceptance, or both.
DIN EN 60749-3:2003 history
- 2018 DIN EN 60749-3:2018 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (IEC 60749-3:2017); German version EN 60749-3:2017
- 2003 DIN EN 60749-3:2003 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection (IEC 60749-3:2002); German version EN 60749-3:2002
- 0000 DIN EN 60749:2002
