DIN EN 60191-4:2003
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999 + A1:2001 + A2:2002); German version EN 60191-4:1999 + A1:2002 + A2:2002

Standard No.

DIN EN 60191-4:2003

Release Date

2003

Published By

German Institute for Standardization

Status

Withdraw

Replace By

DIN EN 60191-4:2014

Latest

DIN EN 60191-4:2019-02

Replace

DIN EN 60191-4:2002 DIN EN 60191-4/A2:2002

Scope

The document describes a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The new amendment of Annex B contains a derivation and application of the descriptive coding system.

DIN EN 60191-4:2003 history

• 2019 DIN EN 60191-4:2019-02 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018 / Note: DIN EN 60191-...
• 1970 DIN EN 60191-4:2019 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• 1970 DIN EN 60191-4 A1 E:2017-04
• 2017 DIN EN 60191-4/A1 E:2017 Draft Document - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 47D/882/CD:2016)
• 2014 DIN EN 60191-4:2014 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013); German version EN 60191-4:2014
• 2003 DIN EN 60191-4:2003 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999 + A1:2001 + A2:2002); German version EN 60191-4:1999 + A1:2002 + A2:2002
• 0000 DIN EN 60191-4/A2:2002