ISO 9455-17:2002
Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
- Standard No.
- ISO 9455-17:2002
- Release Date
- 2002
- Published By
- International Organization for Standardization (ISO)
- Status
- Replace By
- ISO 9455-17:2023
- Latest
- ISO 9455-17:2024
- Scope
- This part of ISO 9455 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) solders (ISO 9453:1990, Class E). NOTE This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.
ISO 9455-17:2002 history
- 2024 ISO 9455-17:2024 Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
- 2023 ISO 9455-17:2023 Soft soldering fluxes
- 2002 ISO 9455-17:2002 Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
