Blank Detail Specification: Fixed low power non wire-wound surface mount (SMD) resistors
Introduction
1 Characteristics and ratings
1.1 Dimensions and ratings
1.2 Derating curve
1.3 Resistance range and tolerance on rated resistance
1.4 Variation of resistance with temperature and temperature rise
1.5 Climatic categories
1.6 Limits for change of resistance at tests
1.7 Non-linear properties
1.8 Marking, packaging and ordering designation
1.8.1 Component
1.8.2 Package
1.8.3 Packaging / Taping
1.8.4 Ordering information
1.9 Additional information (not for inspection purpose)
1.9.1 Storage
1.9.2 Mounting
1.9.3 Soldering process
1.9.4 Use of cleaning solvents
2 Quality assessment procedures
2.1 General
2.1.1 Zero defect approach
2.1.2 100%-Test
2.1.3 0Ω-Resistor
2.1.4 Certificate of Conformity (CoC)
2.1.5 Certified test records
2.1.6 Failure rate level (only version E)
2.2 Qualification Approval
2.2.1 Version A
2.2.2 Version E
2.3 Quality conformance inspection
2.3.1 Qualification approval according to EN 100114-2
2.3.2 Technology approval according to EN 100114-6
2.3.3 Non-conforming items
Annex A (normative) Fixed sample size Qualification Approval and Quality Conformance Inspection test schedule for fixed low power surface mounting (SMD) resistors
Annex B (informative) Letter symbols and abbreviations
Annex C (normative) Standards referred to in this specification
BS EN 140401:2002 history
2009BS EN 140401:2009 Blank Detail Specification - Fixed low power film surface mount (SMD) resistors
2002BS EN 140401:2002 Blank detail specification - Fixed low power non wire-wound surface mount (SMD) resistors
1997BS EN 140401:1997 Harmonized system of quality assessment for electronic components - Blank detail specification - Fixed low power non-wire wound surface mounting (SMD) resistors