This standard specifies the requirements, test methods, inspection specifications and marking, packaging, transportation, storage and order form (or contract) content for copper wire used for bonding semiconductor devices. This standard applies to copper wire for bonding semiconductor devices (hereinafter referred to as copper wire).
YS/T 678-2008 Referenced Document
GB/T 10573 Tensile testing method for fine wire of nonferrous metals*, 2020-09-29 Update
GB/T 13293.1 Higher purity copper cathode.Determination of selenium and tellurum contents.Catalytic oscillopolarographic method