IEC PAS 60191-6-18:2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Standard No.

IEC PAS 60191-6-18:2008

Release Date

2008

Published By

International Electrotechnical Commission (IEC)

Status

Withdraw

Latest

IEC PAS 60191-6-18:2008

Replace By

IEC 60191-6-18:2010

Scope

This PAS provides common outline drawings and dimensions for all types of structures and composed materials of ball grid array (hereinafter called BGA), whose terminal pitch is one millimetre or larger and whose package body outline is square.

IEC PAS 60191-6-18:2008 history

• 2008 IEC PAS 60191-6-18:2008 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

IEC PAS 60191-6-18:2008 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) was changed to IEC 60191-6-18:2010 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA).