IEC 60191-6-12:2002
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch land grid array (FLGA); Rectangular type

Standard No.

IEC 60191-6-12:2002

Release Date

2002

Published By

International Electrotechnical Commission (IEC)

Status

Be replaced 2011-06

Replace By

IEC 60191-6-12:2011

Latest

IEC 60191-6-12:2011

Scope

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.

IEC 60191-6-12:2002 history

• 2011 IEC 60191-6-12:2011 Normalisation mécanique des dispositifs à semiconducteurs – Partie 6-12: Règles générales pour la préparation des dessins d'encombrement des bo?tiers des dispositifs à semiconducteurs à montage en surface – Lignes directrices de conception pour les bo?tie
• 2002 IEC 60191-6-12:2002 Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch land grid array (FLGA); Rectangular type