IPC J-STD-006B-2006
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
- Standard No.
- IPC J-STD-006B-2006
- Release Date
- 2006
- Published By
- Institute of Interconnecting and Packaging Electronic Circuits (IPC)
- Status
- 2006-01
- Replace By
- IPC J-STD-006B-2008
- Scope
- This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for “special” electronic grade solders. This is a quality control standard and is not intended to relate directly to the material’s performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32.
