IPC J-STD-006B-2008
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Incorporates Amendment A1 and A2: October 2009

Standard No.

IPC J-STD-006B-2008

Release Date

2008

Published By

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

Status

Withdraw

Scope

This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for ‘‘special’’ electronic grade solders. This is a quality control standard and is not intended to relate directly to the material’s performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32. This standard is one of a set of three joint industry standards that prescribe the requirements and test methods for soldering materials for use in the electronics industry. The other two joint industry standards are: IPC/EIA J-STD-004 Requirements for Soldering Fluxes IPC/EIA J-STD-005 Requirements for Soldering Pastes Additionally, marking requirements for lead-free materials and assemblies is addressed in this document by direct application of text from IPC/JEDEC J-STD-609, Lead- Free and Leaded Marking, Symbols and Labels (see 6.5).