IPC 6015-1998
Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures

Standard No.

IPC 6015-1998

Release Date

1998

Published By

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

Latest

IPC 6015-1998

Scope

This specification establishes the specific requirements for the organic mounting structure used to interconnect chip components, which in combination form the completed functional Organic Single-chip Module (SCM-L) or Organic Multichip Module (MCM-L) assembly, and the quality and reliability assurance requirements that must be met for their acquisition.

IPC 6015-1998 history

• 1998 IPC 6015-1998 Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures