IPC 1066-2005
Marking, Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies, Components and Devices

Standard No.

IPC 1066-2005

Release Date

2005

Published By

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

Status

Withdraw

Latest

IPC 1066-2005

Scope

This standard establishes the requirements for a distinctive symbol and labels to be used to identify materials that are lead-free (Pb-free) and are capable of providing Pb-free 2nd level interconnects, and for indicating certain types of Pb-free material and the maximum assembly temperature. It also establishes the requirements for labeling a bare board if the base resin is halogen free and the type of conformal coating used after assembly.

IPC 1066-2005 history

• 2005 IPC 1066-2005 Marking, Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies, Components and Devices
• 2004 IPC 1066-2004 Marking@ Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies@ Components and Devices