JEDEC JEP140-2002
Beaded Thermocouple Temperature Measurement of Semiconductor Packages

Standard No.

JEDEC JEP140-2002

Release Date

2002

Published By

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

Latest

JEDEC JEP140-2002

Scope

This method specifies procedures to determine the temperature of a component or its solder joint over time as it is exposed to temperature gradients due to testing or processing. It defines appropriate thermometry sensors, tools, and attachment methods for temperature measurement of semiconductor packages in the applications mentioned in the Foreword..

JEDEC JEP140-2002 history

• 2002 JEDEC JEP140-2002 Beaded Thermocouple Temperature Measurement of Semiconductor Packages