BS EN 61190-1-3:2007 Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
This part of IEC 61190 prescribes the requirements and test methods for electronic grade
solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for
electronic soldering applications and for “special” electronic grade solders. For the generic
specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This
standard is a quality control document and is not intended to relate directly to the material's
performance in the manufacturing process
Special electronic grade solders include all solders which do not fully comply with the
requirements of standard solder alloys and solder materials listed herein. Examples of special
solders include anodes, ingots, preforms, bars with hook and eye ends, multiple-alloy solder
powders, etc.
BS EN 61190-1-3:2007 history
2007BS EN 61190-1-3:2007+A1:2010 Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
2007BS EN 61190-1-3:2007 Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
2002BS EN 61190-1-3:2002 Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications