GJB 5914-2006 (English Version) PDF

Standard No.: GJB 5914-2006
Language: Chinese, Available in English version
Release Date: 2006
Published By: Military Standard of the People's Republic of China-Commission of Science,Technology and Industry for National Defence
Latest: GJB 5914-2006

Scope: This standard specifies the destructive physical analysis (DPA) methods of various military-quality semiconductor devices included in GJB/Z 299B-1998 "Electronic Equipment Reliability Prediction Manual", including the general requirements of the DPA program and semiconductor devices of different quality grades. General methods and defect criteria for DPA testing and analysis. This standard applies to various military-quality semiconductor devices that have DPA requirements.

GJB 5914-2006 Referenced Document

GJB 128A-1997 Semiconductor discrete device test methods
GJB 4027A-2006 Methods of destructive physical analysis for military electronic components
GJB 4152-2001 Multilayer ceramic capacitors and similar components cross-section preparation and inspection methods
GJB 548A-1996 Microelectronic device test methods and procedures
GJB/Z 299B-1998 Electronic Equipment Reliability Prediction Handbook

2006 GJB 5914-2006 Methodsof destructive physical analysis for military semiconductor devices of all kinds of quality class