IEC 60191-6-16:2007
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
- Standard No.
- IEC 60191-6-16:2007
- Release Date
- 2007
- Published By
- International Electrotechnical Commission (IEC)
- Latest
- IEC 60191-6-16:2007
- Replace
- IEC 47D/679/FDIS:2007
- Scope
- This part of IEC 60191 gives a glossary of semiconductor sockets for BGA, LGA, FBGA and FLGA. This standard intends to establish definitions and unification of terminology relating to tests and burn-in sockets for BGA, LGA, FBGA and FLGA.
IEC 60191-6-16:2007 Referenced Document
- IEC 60191-1:1966 Mechanical standardization of semiconductor devices. Part 1 : Preparation of drawings of semiconductor devices
- IEC 60191-2:1966 Mechanical standardization of semiconductor devices. Part 2 : Dimensions
- IEC 60191-3:1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
- IEC 60191-4:1999 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60191-6-16:2007 history
- 2007 IEC 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
