DIN EN 61189-5:2007
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies (IEC 61189-5:2006); German version EN 61189-5:2006
- Standard No.
- DIN EN 61189-5:2007
- Release Date
- 2007
- Published By
- German Institute for Standardization
- Status
- Replace By
- DIN EN 61189-5-1:2017
- DIN EN 61189-5-2:2015
- DIN EN 61189-5-3:2015
- DIN EN 61189-5-4:2015
- DIN EN 61189-5:2007-05
- Latest
- DIN EN 61189-5-1:2017
- DIN EN 61189-5-2:2015
- DIN EN 61189-5-3:2015
- DIN EN 61189-5-4:2015
- DIN EN 61189-5:2007-05
DIN EN 61189-5:2007 Referenced Document
- IEC 61189-1 Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
- IEC 61189-3 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)*， 2007-10-01 Update
- IEC 61189-6 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in electronic assemblies
- IEC 61190-1-1 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
- IEC 61190-1-3 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications*， 2017-12-13 Update
- IEC 61249-2-7 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad; Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
- ISO 5725-2 Accuracy (trueness and precision) of measurement methods and results — Part 2: Basic method for the determination of repeatability and reproducibility of a standard measurement method*， 2019-12-06 Update
- ISO 9001 Quality management systems*， 2024-01-01 Update
- ISO 9455-1 Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method*， 2022-12-02 Update
- ISO 9455-2 Soft soldering fluxes; test methods; part 2: determination of non-volatile matter, ebulliometric method
DIN EN 61189-5:2007 history
- 2017 DIN EN 61189-5-1:2017 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (IEC 61189-5-1:2016); German version EN 61189-5
- 2007 DIN EN 61189-5:2007 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies (IEC 61189-5:2006); German version EN 61189-5:2006
