YS/T 641-2007
Aluminium wire for semiconductor lead bonding (English Version)
- Standard No.
- YS/T 641-2007
- Language
- Chinese, Available in English version
- Release Date
- 2007
- Published By
- Professional Standard - Non-ferrous Metal
- Latest
- YS/T 641-2007
- Scope
- This standard specifies the requirements, test methods, inspection rules and marking, packaging, transportation and storage of aluminum wire for bonding semiconductor devices. This standard applies to aluminum wire for bonding semiconductor devices (hereinafter referred to as aluminum wire).
YS/T 641-2007 Referenced Document
- GB/T 6987.17 Aluminium and aluminium alloys--Determination of magnesium content--Flame atomic absorption spectrometric method
- GB/T 6987.2 Aluminium and aluminium alloys--Determination of copper content--Oxalyldihydrazide spectrophotometric method
- GB/T 6987.4 Aluminium and aluminium alloys--Determination of iron content--Orthopenanthroline photometric method
- GB/T 6987.6 Aluminium and aluminium alloys--Determination of silicon content--Molybdenum blue spectrophotometric method
- GB/T 6987.7 Aluminium and aluminium alloys--Determination of manganese content--Potassium periodate spectrophotometric method
- GB/T 6987.9 Aluminium and aluminium alloys--Determination of zinc conten--Flame atomic absorption spectrometric method
YS/T 641-2007 history
- 2007 YS/T 641-2007 Aluminium wire for semiconductor lead bonding
