BS EN 60191-6-2:2002
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Standard No.

BS EN 60191-6-2:2002

Release Date

2002

Published By

British Standards Institution (BSI)

Status

Be replaced

Replace By

BS EN 60191-6-2:2002(2003)

Latest

BS EN 60191-6-2:2002(2003)

Scope

This part of IEC 60191 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).

BS EN 60191-6-2:2002 history

• 0000 BS EN 60191-6-2:2002(2003)
• 2002 BS EN 60191-6-2:2002 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages