DIN EN 61189-6:2007
Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies (IEC 61189-6:2006); German version EN 61189-6:2006
- Standard No.
- DIN EN 61189-6:2007
- Release Date
- 2007
- Published By
- German Institute for Standardization
- Status
- Replace By
- DIN EN 61189-6:2007-03
- Latest
- DIN EN 61189-6:2007-03
- Replace
- DIN IEC 61189-6:2002
- Scope
- This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblies.
DIN EN 61189-6:2007 Referenced Document
- IEC 61189-1 Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
- IEC 61190-1-1 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
- IEC 61190-1-3 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications*， 2017-12-13 Update
- ISO 9001 Quality management systems - Requirements [Spanish version]
DIN EN 61189-6:2007 history
- 2007 DIN EN 61189-6:2007-03 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies (IEC 61189-6:2006); German version EN 61189-6:2006
- 2007 DIN EN 61189-6:2007 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies (IEC 61189-6:2006); German version EN 61189-6:2006
- 0000 DIN IEC 61189-6:2002
