BS EN 62258-6:2006
Semiconductor die products - Requirements for information concerning thermal simulation
- Standard No.
- BS EN 62258-6:2006
- Release Date
- 2006
- Published By
- British Standards Institution (BSI)
- Latest
- BS EN 62258-6:2006
- Replace
- 05/30139923 DC-2005 PD ES 59008-4-3-2000
- Scope
- This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including: • wafers; • singulated bare die; • die and wafers with attached connection structures; • minimally or partially encapsulated die and wafers. This part of IEC 62258 determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2.
BS EN 62258-6:2006 Referenced Document
- IEC 62258-1 Semiconductor die products - Part 1: Procurement and use*， 2009-04-01 Update
- IEC 62258-2 Semiconductor die products - Part 2: Exchange data formats*， 2011-05-01 Update
BS EN 62258-6:2006 history
- 2006 BS EN 62258-6:2006 Semiconductor die products - Requirements for information concerning thermal simulation
