BS EN 61189-6:2006
Test methods for electrical materials, interconnection structures and assemblies - Test methods for materials used in manufacturing electronic assemblies
- Standard No.
- BS EN 61189-6:2006
- Release Date
- 2006
- Published By
- British Standards Institution (BSI)
- Latest
- BS EN 61189-6:2006
- Replace
- 02/206656 DC-2002
- Scope
- This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblies.
BS EN 61189-6:2006 Referenced Document
- IEC 61189-1 Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
- IEC 61190-1-1 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
- IEC 61190-1-3 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications*， 2017-12-13 Update
- ISO 9001 Quality management systems - Requirements [Spanish version]
BS EN 61189-6:2006 history
- 2006 BS EN 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Test methods for materials used in manufacturing electronic assemblies
