DIN EN 60191-6-8:2002
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); Germa
- Standard No.
- DIN EN 60191-6-8:2002
- Release Date
- 2002
- Published By
- German Institute for Standardization
- Status
- Replace By
- DIN EN 60191-6-8:2002-05
- Latest
- DIN EN 60191-6-8:2002-05
- Replace
- DIN IEC 47D/131/CD:1996
- Scope
- The document provides outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (G-QFP).
DIN EN 60191-6-8:2002 history
- 2002 DIN EN 60191-6-8:2002-05 Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); Ge...
- 2002 DIN EN 60191-6-8:2002 Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); Germa
