DIN EN 60191-6-5:2002
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German version
- Standard No.
- DIN EN 60191-6-5:2002
- Release Date
- 2002
- Published By
- German Institute for Standardization
- Status
- Replace By
- DIN EN 60191-6-5:2002-05
- Latest
- DIN EN 60191-6-5:2002-05
- Replace
- DIN IEC 47D/195/CD:1998
- Scope
- The document provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array (hereinafter called FBGA), whose terminals pitch is less than, or equal to 0,80 mm and whose package body outline is square.#,,#
DIN EN 60191-6-5:2002 history
- 2002 DIN EN 60191-6-5:2002-05 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German vers...
- 2002 DIN EN 60191-6-5:2002 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German version
