JB/T 10620-2006 (English Version) PDF

Scope: This standard specifies the technical requirements and test methods for copper-tin alloy electroplating layers with a copper content of 50% to 95% (mass fraction) and a tin content of 50% to 5% (mass fraction). This standard applies to copper-tin alloy electroplating layers for electronic and electrical products to prevent corrosion and improve welding performance. It also applies to the requirements for decorative copper-tin alloy electroplating layers on some other metal products.

JB/T 10620-2006 Referenced Document

GB/T 2423.28 Environmental testing for electric and electronic products.Part2:Test methods-Test T:Soldering
GB/T 3138 Metallic and other inorganic coatings.Surface treatment, metallic and other inorganic coatings.Vocabulary*， 2015-05-15 Update
GB/T 5270 Metallic coatings on metallic substrates-Electrodeposited and chemically deposited coatings-Review of methods available for testing adhesion
GB/T 6461 Methods for corrosion testing of metallic and other inorganic coatings on metallic substrates--Rating of test specimens and manufactured articles subjected to corrosion tests
GB/T 9789 Metallic and other non-organic coatings.Sulfur dioxide test with general condensation of moisture*， 2008-06-19 Update

2006 JB/T 10620-2006 Metallic coating. Electroplated coatings of copper-tin alloys