GB/T 4937.2-2006
Semiconductor devices. Mechanical and climatic test methods. Part 2: Low air pressure (English Version)

Standard No.
GB/T 4937.2-2006
Language
Chinese, Available in English version
Release Date
2006
Published By
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Latest
GB/T 4937.2-2006
Replace
GB/T 4937-1995
Scope
This section applies to low pressure tests for semiconductor devices. The purpose of this test is to determine the ability of components and materials to avoid failure by electrical breakdown due to the weakening of the dielectric strength of air and other insulating materials when the pressure is reduced. This test is only applicable to devices with an operating voltage exceeding 1000V. This test is applicable to all hermetically sealed semiconductor devices. This test applies only to military and space domains. The low air pressure test method of this item is generally consistent with IEC60068-2-13, but in view of the special requirements of semiconductor devices, the terms of this part are used.

GB/T 4937.2-2006 history

  • 2006 GB/T 4937.1-2006 Semiconductor devices. Mechanical and climatic test methods. Part 1: General
  • 1995 GB/T 4937-1995 Mechanical and climatic test methods for semiconductor devices

GB/T 4937.2-2006 Semiconductor devices. Mechanical and climatic test methods. Part 2: Low air pressure has been changed from GB/T 4937-1995 Mechanical and climatic test methods for semiconductor devices.

Semiconductor devices. Mechanical and climatic test methods. Part 2: Low air pressure

GB/T 4937.2-2006 -All Parts

GB/T 4937.1-2006 Semiconductor devices. Mechanical and climatic test methods. Part 1: General GB/T 4937.11-2018 Semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method GB/T 4937.12-2018 Semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations（lead integrity） GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices GB/T 4937.17-2018 Semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation GB/T 4937.18-2018 Semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose) GB/T 4937.19-2018 Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength GB/T 4937.2-2006 Semiconductor devices. Mechanical and climatic test methods. Part 2: Low air pressure GB/T 4937.20-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat GB/T 4937.201-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability GB/T 4937.22-2018 Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength GB/T 4937.23-2023 Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life GB/T 4937.26-2023 Mechanical and Climatic Test Methods for Semiconductor Devices Part 26: Electrostatic Discharge (ESD) Susceptibility Test Human Body Model (HBM) GB/T 4937.27-2023 Mechanical and Climatic Test Methods for Semiconductor Devices Part 27: Electrostatic Discharge (ESD) Susceptibility Test Machine Model (MM) GB/T 4937.3-2012 Semiconductor devices.Mechanical and climatic tests methods.Part 3:External visual examination GB/T 4937.30-2018 Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing GB/T 4937.31-2023 Semiconductor Devices Mechanical and Climatic Test Methods Part 31: Flammability of Plastic Encapsulated Devices (Internally Induced) GB/T 4937.32-2023 Mechanical and climatic test methods for semiconductor devices Part 32: Flammability of plastic encapsulated devices (externally induced) GB/T 4937.34-2024 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling GB/T 4937.35-2024 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopic examination of plastically encapsulated electronic components GB/T 4937.4-2012v Semiconductor Device Mechanical and Climatic Test Methods Part 4: Highly Accelerated Steady State Damp Heat Test (HAST) GB/T 4937.42-2023 Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage


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