This standard specifies the chemical composition, form, test methods, packaging, marking, transportation and storage requirements of lead-free solder products. This standard applies to lead-free solders used in electrical and electronic equipment, communication equipment and other lead wires and component connections.
GB/T 20422-2006 Referenced Document
GB/T 10574.1-2003 Methods for chemical analysis of tin-lead solders--Determination of tin content
GB/T 10574.2-2003 Methods for chemical analysis of Tin-lead solders--Determination of antimony content
GB/T 10574.3-2003 Method for chemical analysis of tin-lead solder - Determination of bismuth content
GB/T 1480-1995 Determination of particle size for metallic powders--Dry sieving