IEC 62047-2:2006
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
- Standard No.
- IEC 62047-2:2006
- Release Date
- 2006
- Published By
- International Electrotechnical Commission (IEC)
- Latest
- IEC 62047-2:2006
- Replace
- IEC 47/1865/FDIS:2006
- Scope
- This International Standard specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 µm, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.
IEC 62047-2:2006 history
- 2006 IEC 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
