IEC 60068-2-54:2006
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

Standard No.

IEC 60068-2-54:2006

Release Date

2006

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 60068-2-54:2006

Replace By

IEC 60068-2-69:2017

Replace

IEC 91/576/FDIS:2006 IEC 60068-2-54:1985

Scope

This part of IEC 60068 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.

IEC 60068-2-54:2006 Referenced Document

• IEC 60068-1:1988 Environmental testing. Part 1: General and guidance
• IEC 60068-2-20:1979 Environmental testing. Part 2: Tests. Test T: Soldering
• IEC 61190-1-3 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications*， 2017-12-13 Update

IEC 60068-2-54:2006 history

• 2006 IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
• 1985 IEC 60068-2-54:1985 Environmental testing. Part 2: Tests. Test TA: Soldering. Solderability testing by the wetting balance method