YS/T 604-2006
Gold based thick film conductor pastes (English Version)
- Standard No.
- YS/T 604-2006
- Language
- Chinese, Available in English version
- Release Date
- 2006
- Published By
- Professional Standard - Non-ferrous Metal
- Status
- 2024-07
- Replace By
- YS/T 604-2023
- Latest
- YS/T 604-2023
- Scope
- This standard specifies the requirements, test methods, inspection rules and marking, packaging, transportation, storage and order form content of gold-based thick film conductor paste. This standard applies to gold-based thick film conductor paste (hereinafter referred to as gold paste) used in thick film hybrid integrated circuits, sensors and other devices.
YS/T 604-2006 Referenced Document
- GB/T 17473.1 Test method of precious metals pastes used for microelectronics.Determination of solids content*， 2008-03-31 Update
- GB/T 17473.2 Test method of precious metals pastes used for microelectronics.Determination of fineness*， 2008-03-31 Update
- GB/T 17473.3 Test method of precious metals pastes used for microelectronics.Determination of sheet resistance*， 2008-03-31 Update
- GB/T 17473.4 Test methods of precious metals pastes used for microelectronics.Determination of adhesion*， 2008-03-31 Update
- GB/T 17473.5 Test method of precious metals pastes used for microelectronics.Determination of viscosity*， 2008-03-31 Update
YS/T 604-2006 history
- 2023 YS/T 604-2023 Gold based thick film conductor paste
- 2006 YS/T 604-2006 Gold based thick film conductor pastes
