GJB 1087A-2005
Specification for RT solidified inorganic adhesive for high temperature resistance (English Version)

Standard No.
GJB 1087A-2005
Language
Chinese, Available in English version
Release Date
2005
Published By
Military Standard of the People's Republic of China-Commission of Science,Technology and Industry for National Defence
Latest
GJB 1087A-2005
Replace
GJB 1087-1991
Scope
This specification stipulates the requirements, quality assurance regulations, delivery preparations and instructions for room temperature curing and high temperature resistant inorganic adhesives prepared from two components: powder and liquid. This specification is applicable to the 105-A high temperature resistant inorganic adhesive used for the positioning, sealing and bonding of temperature measuring components and high temperature resistant components of weaponry.

GJB 1087A-2005 Referenced Document

  • GB/T 10064-1988 Methods of test for the determination of the insulation resistance of solid insulating materials
  • GB/T 1345-1991 Test method for fineness of cement--The 80μm sieve
  • GB/T 1346-2001 Test methods for water requirement of normal consistency,setting time and soundness of the portland cements
  • GB/T 177-1985 Test method for strength of hydraulic cement mortar
  • GB/T 7322-1997 Test method for pyrometric cone equivalent (refractoriness) of refractories

GJB 1087A-2005 history

  • 2005 GJB 1087A-2005 Specification for RT solidified inorganic adhesive for high temperature resistance
  • 1991 GJB 1087-1991 Room temperature curing high temperature inorganic adhesive

GJB 1087A-2005 Specification for RT solidified inorganic adhesive for high temperature resistance has been changed from GJB 1087-1991 Room temperature curing high temperature inorganic adhesive.




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