This part of IEC 61967 provides a test procedure which defines a method for evaluating the near electric, magnetic or electromagnetic field components at or near the surface of an integrated circuit (IC). This diagnostic procedure is intended for IC architectural analysis such as floor planning and power distribution optimization. This test procedure is applicable to measurements from an IC mounted on any circuit board that is accessible to the scanning probe. For comparison of surface scan emissions between different ICs, the standardized test board defined in IEC 61967-1 should be used. This technique is capable of providing a detailed pattern of the radio frequency (RF) sources internal to the IC. The resolution of the measurement is determined by the capability of the measurement probe and the precision of the probe positioner. This method is intended for use over the 10 MHz to 1 GHz frequency range. Extended upper frequency limits are possible with existing probe technology but are beyond the scope of this specification. The probe is mechanically scanned according to a programmed pattern in a parallel or perpendicular plane to the IC surface. The data is computer processed to provide a colour-enhanced representation of the field strength at the scan frequency.
BS DD IEC/TS 61967-3:2005 history
2014BS PD IEC/TS 61967-3:2014 Integrated circuits. Measurement of electromagnetic emissions. Measurement of radiated emissions. Surface scan metho