JIS C 61191-1:2006
Printed board assemblies -- Part 1: Generic specification -- Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Standard No.

JIS C 61191-1:2006

Release Date

2006

Published By

Japanese Industrial Standards Committee (JISC)

Status

Withdraw

Replace By

JIS C 61191-1:2015

JIS C 61191-1 ERRATUM 1:2014

Latest

JIS C 61191-1:2015

JIS C 61191-1 ERRATUM 1:2014

Scope

This standard specifies requirements for materials, methods and verification criteria for producing high quality solder joints and assemblies using surface mount and related mounting techniques.

JIS C 61191-1:2006 Referenced Document

• JIS C 60721-3-1 Classification of environmental conditions -- Part 3-1: Classification of groups of environmental parameters and their severities -- Storage*， 2022-08-22 Update
• JIS C 61191-2 Printed board assemblies -- Part 2: Sectional specification -- Requirements for surface mount soldered assemblies*， 2015-11-20 Update
• JIS C 61191-3 Printed board assemblies -- Part 3: Sectional specification -- Requirements for through-hole mount soldered assemblies
• JIS C 61191-4 Printed board assemblies -- Part 4: Sectional specification -- Requirements for terminal soldered assemblies

JIS C 61191-1:2006 history

• 2021 JIS C 61191-1:2021 Printed board assemblies -- Part 1: Generic specification -- Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
• 2015 JIS C 61191-1:2015 Printed board assemblies -- Part 1: Generic specification -- Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
• 2006 JIS C 61191-1:2006 Printed board assemblies -- Part 1: Generic specification -- Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies