1.1 Form:This specification covers the engineering requirements for electrodeposition of gold and theproperties of the deposit.1.2 Application:This plating has been used typically to improve the solderability, electrical conductivity, corrosionresistance, performance, and appearance of electronic and electrical parts, but usage is not limited to such applications.1.3 Safety - Hazardous Materials:While the materials, methods, applications, and processes described or referenced in thisspecification may involve the use of hazardous materials, this specification does not address thehazards which may be involved in such use. It is the sole responsibility of the user to ensurefamiliarity with the safe and proper use of any hazardous materials and to take necessaryprecautionary measures to ensure the health and safety of all personnel involved.