BS EN 60191-6-5:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitchball grid array (FBGA)
- Standard No.
- BS EN 60191-6-5:2001
- Release Date
- 2001
- Published By
- British Standards Institution (BSI)
- Latest
- BS EN 60191-6-5:2001
- Scope
- This part of IEC 60191 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array (hereinafter called FBGA), whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square. The demand for area array style packages exists according to the multi-functioning and high performance of electrical equipment. The object of this design guide is to standardize outlines and secure interchangeability of FBGA packages. The terminal pitch and package outlines of these fine-pitch array packages are smaller than those of BGA packages.
BS EN 60191-6-5:2001 history
- 2001 BS EN 60191-6-5:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitchball grid array (FBGA)
