IEC 60191-6-1:2001
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals

Standard No.

IEC 60191-6-1:2001

Release Date

2001

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 60191-6-1:2001

Replace

IEC 47D/459/FDIS:2001

Scope

This part of IEC 60191 covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads; e.g., QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4. This publication is intended to establish common rules on terminal shapes irrespective of package types. note: 1) IEC 60191-4:199, Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages.

IEC 60191-6-1:2001 history

• 2001 IEC 60191-6-1:2001 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals