IEC 60191-6-8:2001
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP)
- Standard No.
- IEC 60191-6-8:2001
- Release Date
- 2001
- Published By
- International Electrotechnical Commission (IEC)
- Latest
- IEC 60191-6-8:2001
- Replace
- IEC 47D/438/FDIS:2001
- Scope
- This part of IEC 60191 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.
IEC 60191-6-8:2001 history
- 2001 IEC 60191-6-8:2001 Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP)
