DIN EN 60191-6-3:2001
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000);
- Standard No.
- DIN EN 60191-6-3:2001
- Release Date
- 2001
- Published By
- German Institute for Standardization
- Status
- Replace By
- DIN EN 60191-6-3:2001-06
- Latest
- DIN EN 60191-6-3:2001-06
- Replace
- DIN IEC 47D/221/CDV:1998
- Scope
- The document stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.
DIN EN 60191-6-3:2001 history
- 2001 DIN EN 60191-6-3:2001-06 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:200...
- 2001 DIN EN 60191-6-3:2001 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000);
