IEC 60191-6-6:2001
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA)

Standard No.

IEC 60191-6-6:2001

Release Date

2001

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 60191-6-6:2001

Replace

IEC 47D/404/FDIS:2000 IEC 47D/404A/FDIS:2001

Scope

This part of IEC 60191 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.

IEC 60191-6-6:2001 history

• 2001 IEC 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA)