IEC PAS 62170:2000
Bond wire modeling standard

Standard No.

IEC PAS 62170:2000

Release Date

2000

Published By

International Electrotechnical Commission (IEC)

Latest

IEC PAS 62170:2000

Scope

This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package lead in a ball or wedge type wire bond configuration.

IEC PAS 62170:2000 history

• 2000 IEC PAS 62170:2000 Bond wire modeling standard