IEC 60191-6-3:2000
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quad flat packs (QFP)

Standard No.

IEC 60191-6-3:2000

Release Date

2000

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 60191-6-3:2000

Replace

IEC 47D/370/FDIS:2000

Scope

This part of IEC 60191 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.

IEC 60191-6-3:2000 history

• 2000 IEC 60191-6-3:2000 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quad flat packs (QFP)