JIS C 6494:1999
Base materials for printed circuits -- Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Standard No.

JIS C 6494:1999

Release Date

1999

Published By

Japanese Industrial Standards Committee (JISC)

Latest

JIS C 6494:1999

Replace

JIS C 6494:1994

Scope

This standard specifies the characteristics of flame-resistant grade (vertical flame-retardant) glass cloth base bismaleimide/triazine epoxy resin copper-clad laminates (hereinafter referred to as copper-clad laminates) for multilayer printed wiring boards. Establish.

JIS C 6494:1999 history

• 1999 JIS C 6494:1999 Base materials for printed circuits -- Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
• 1994 JIS C 6494:1994 Thin copper-clad laminates for multilayer printed wiring boards -- Glass fabric base, Bismaleimide/Triazine/Epoxide