DIN 50441-4:1999 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 4: Slice diameter, diamter variation, flat diameter, flat length, flat depth
The methods according to the document cover the determination of the slice diameter, diameter variation, flat diameter, flat length and flat depth. They are nondestructive regarding mechanical damages.#,,#
DIN 50441-4:1999 history
1999DIN 50441-4:1999 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 4: Slice diameter, diamter variation, flat diameter, flat length, flat depth