BS 3934-5:1997
Mechanical standardization of semiconductor devices. Recommendations applying to tape automated bonding (TAB) of integrated circuits

Standard No.

BS 3934-5:1997

Release Date

1997

Published By

British Standards Institution (BSI)

Latest

BS 3934-5:1997

Replace

93/216730 DC-1993 BS 3934 Part 5:1992

Scope

Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).

BS 3934-5:1997 history

• 1997 BS 3934-5:1997 Mechanical standardization of semiconductor devices. Recommendations applying to tape automated bonding (TAB) of integrated circuits