IEC 61709:1996
Electronic components - Reliability - Reference conditions for failure rates and stress models for conversion
- Standard No.
- IEC 61709:1996
- Release Date
- 1996
- Published By
- International Electrotechnical Commission (IEC)
- Status
- 2017-02
- Replace By
- IEC 61709:2011
- Latest
- IEC 61709:2017/COR1:2019
- Scope
- This International Standard gives guidance on the use of failure rate data for the reliability prediction of components in electronic equipment. Reference conditions for failure rate data are specified, so that data from different sources can be compared on a uniform basis. If failure rate data are given in accordance with this standard then no additional information on the specified conditions is required. The stress models described in this standard should be used as a basis for conversion of the failure rate data at reference conditions to the actual operating conditions. Conversion of failure rate data are only permissible within the specified functional limits of the components (see annex A).
IEC 61709:1996 history
- 2017 IEC 61709:2017/COR1:2019 Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
- 0000 IEC 61709:2017 RLV
- 2011 IEC 61709:2011 Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
- 1996 IEC 61709:1996 Electronic components - Reliability - Reference conditions for failure rates and stress models for conversion
