IEEE Std 1838-2019
IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits

Standard No.

IEEE Std 1838-2019

Release Date

2020

Published By

Institute of Electrical and Electronics Engineers (IEEE)

Latest

IEEE Std 1838-2019

Scope

IEEE Std 1838 is a die-centric standard; it applies to a die that is intended to be part of a multi-die stack. This standard defines die-level features that, when compliant dies are brought together in a stack, comprise a stack-level architecture that enables transportation of control and data signals for the test of (1) intra-die circuitry and (2) inter-die interconnects in both (a) pre-stacking ...

IEEE Std 1838-2019 history

• 2020 IEEE Std 1838-2019 IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits