EN IEC 63251:2023
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

Standard No.

EN IEC 63251:2023

Release Date

2023

Published By

European Committee for Electrotechnical Standardization（CENELEC）

Latest

EN IEC 63251:2023

EN IEC 63251:2023 history

• 2023 EN IEC 63251:2023 Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress